Coated Diamond Powder
Coated powder increases the particle retention in most bond systems. It also facilitates heat dissipation within the bond system resulting in longer tool life. We offer MDP, RDP, and cBNP powders with either a Nickel or a Copper electroless coating. Nickel and Copper Coated Products
Plated diamond particles - Metal coated diamond powder
☆Chemical nickel-plated diamond particles:the product is mainly used to fabricate resin-bonded tools for dry and wet grinding processing of materials.In the process of chemical plating,current is not necessary,metal coated layer on the surface of diamond particle is carried out by self-catalytic redox reaction,so the metal layer formed shows
Electroless Plating of Ni-P-W Coatings Containing
Electroless plating is an autocatalytic process, which is widely used for the production of uniform films in many industrial applications 1-3. It has been reported that the Ni-P coatings prepared by electroless plating have some outstanding mechanical and chemical properties, such as good corrosion
Ti-coated Diamond Powder
The chemical bonding of diamond and the plating will make the diamond better infiltrated, thus improving the bonding of the diamond and the matrix. The plating can isolate the diamond from oxygen to prevent the diamond being oxidized due to high temperature.
Electroless deposition of diamond powder dispersed nickel
initial strike plating of nickel–phosphorus followed by nickel–phosphorus plating with included diamond particles. The electroless technology for deposition of nickel–phosphorus coatings dispersed with diamond powder on steel substrates for the production of diamond tooling instruments had been significantly developed in this study.
What Causes Plating to Flake or Loose Adhesion?
What causes plating to “flake” or loose adhesion and what can be done to ensure proper adhesion of a plated layer? Adhesion is clearly paramount in both decorative and functional finishes. In situations where the adhesion of a plated deposit fails, the loss of adhesion is often blamed on the deposit itself.
Improving the adhesion of electroless-nickel coating layer
An electroless-nickel plating method with semi-batch reactor was employed to coat diamond powders. Ni–P fines are known to be a main cause for generating pore structure in the nickel coating layer was eliminated by lowering the rate of reduction by means of temperature, pH and feeding rate of reductant.